Overcomes the need for manual handling of expensive bumped wafers
Overcomes the need for operator control of loadtool to bump alignment
Increased throughput of bump testing

KEY FEATURES

Joystick manipulation of the test head over 100% of wafer surface without repositioning the wafer on the chuck.
Semi-automatic test routines for bondtesting of the entire wafer surface without repositioning the wafer on the chuck (no camera system needed). 2 reference points needed per wafer.
460mm x 300mm XY stage
Wafer size 200mm or 300mm
Optional image capture system
360 degree manual chuck rotation
360 degree loadtool rotation. Automatic during auto test; manual under joystick conrol.
Safety interlocks on wafer chuck
Frame protection for 300mm wafer
Provision for interface to customer's robot handler and other SMIF equipment

BONDTESTER for 12" Wafer

The DAGE 4300 is a new generation bondtester which complements DAGE proven semi-automatic wafer testers (DAGE 4000W). It has been engineered in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers. It offers similar advantages to the DAGE 4000W in the avoidance of manual handling of valuable wafers and increased productivity in bump testing